| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the light extraction efficiency in an FC (flip-chip) packaging technology of a semiconductor light-emitting element. <P>SOLUTION: A semiconductor light-emitting element 10 has: a lamination semiconductor layer 100 in which a first (n-type) semiconductor layer 140 having a first conductivity type, a light-emitting layer 150, and a second (p-type) semiconductor layer 160 having a second conductivity type opposed to the first conductivity type are laminated; a first electrode 180 formed on a surface of the n-type semiconductor layer 140 of the lamination semiconductor layer 100; and a second electrode 170 formed on a surface of the p-type semiconductor layer 160 of the lamination semiconductor layer 100. The second electrode 170 has: a transparent conductive layer 171 having light permeability and conductivity and formed on the p-type semiconductor layer 160 of the lamination semiconductor layer 100 so that a film surface on an opposite side of the p-type semiconductor layer 160 side has an uneven shape, or so that a discontinuous part not covering the p-type semiconductor layer 160 is provided; and a metallic reflection layer 172 provided on the transparent conductive layer 171 and having light reflectivity. <P>COPYRIGHT: (C)2012,JPO&INPIT |
