发明名称 PLATING PRETREATMENT LIQUID AND METHOD FOR PRODUCING ALUMINUM SUBSTRATE FOR HARD DISK DEVICES USING SAME
摘要 <p>The objective of the present invention is to obtain: a plating pretreatment liquid which is capable of converting the surface of an aluminum substrate for hard disk devices into a surface that is suitable for electroless nickel plating; and a method for producing an aluminum substrate for hard disk devices, which uses the plating pretreatment liquid. This plating pretreatment liquid, which is used in a plating pretreatment for the production of an aluminum substrate for hard disk devices, has an iron ion concentration of 0.1 g/l to 1.0 g/l and a nitric acid concentration of 2.0 wt% to 12.0 wt%. This plating pretreatment liquid is used in a pretreatment for a plating process in which an aluminum substrate for hard disk devices is subjected to electroless nickel plating. Consequently, the surface of the aluminum substrate for hard disk devices is converted into a surface that is suitable for electroless Ni plating, so that a smooth plating film surface can be obtained by suppressing the formation of waves, nodules and pits in the plating surface in cases where electroless nickel plating is carried out in the plating step.</p>
申请公布号 WO2012102161(A1) 申请公布日期 2012.08.02
申请号 WO2012JP51049 申请日期 2012.01.19
申请人 TOYO KOHAN CO., LTD.;MUKAI NOBUAKI;YOSHIDA TAKAHIRO 发明人 MUKAI NOBUAKI;YOSHIDA TAKAHIRO
分类号 C23C18/18;C23C18/36 主分类号 C23C18/18
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