| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder inspection method, a board inspection system, and a solder inspection machine that highly accurately distinguish whether the condition of solder is proper or not by applying a different inspection criterion depending on the condition of a portion to be inspected as of before a reflow process is performed. <P>SOLUTION: A solder printing inspection machine 10 inspects the volume of a cream solder on a land of a board while a solder inspection machine 30 inspects the height of a wet solder as of after a reflow. In the solder inspection machine 30, an inspection program containing a plurality of patterns of determination criterion values for determining the measurement value of the height of the wet solder as well as a selection rule for selecting the determination criterion values are registered. The selection rule has a definition as to which determination criterion value is selected depending on the volume of the cream solder obtained when the solder printing inspection machine 10 inspected a soldered portion to be inspected. The solder printing inspection machine 10 reads the volume of the cream solder corresponding to the soldered portion to be inspected from an inspection data management device 102, and determines a determination criterion value based on the read volume. <P>COPYRIGHT: (C)2012,JPO&INPIT |
