发明名称 3D SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first mono-crystallized semiconductor layer; and a second mono-crystallized semiconductor layer; wherein said first and second mono-crystallized semiconductor layers are overlaying one on top of the other, and wherein said first mono-crystallized semiconductor layer comprise repeating memory structure with sub structures defined by etching.
申请公布号 US2012196409(A1) 申请公布日期 2012.08.02
申请号 US20100941073 申请日期 2010.11.07
申请人 OR-BACH ZVI 发明人 OR-BACH ZVI
分类号 H01L21/768 主分类号 H01L21/768
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