PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM

摘要

[Problem] To provide a plating apparatus that efficiently heats a plating solution. [Solution] A plating apparatus (20) comprises a substrate rotating/holding mechanism (110) that rotatably holds a substrate (2), and a plating solution supply mechanism (30) that supplies a plating solution (35) to the substrate (2). The plating solution supply mechanism (30) has: a supply tank (31) that stores the plating solution (35) to be supplied to the substrate (2); a discharge nozzle (32) that discharges the plating solution (35) to the substrate (2); and a plating solution supply pipe (33) that supplies the plating solution (35) in the supply tank (31) to the discharge nozzle (32). In addition, a first heating mechanism (50) that heats the plating solution (35) to a first temperature is attached to either the supply tank (31) or the plating solution supply pipe (33) in the plating solution supply mechanism (30). Also, a second heating mechanism (60) that heats the plating solution (35) to a second temperature that is higher than the first temperature is attached to the plating solution supply pipe (33), further on the discharge nozzle (32) side than the first heating mechanism (50).