| 摘要 |
A backlight assembly is provided for deployment within a flat panel display assembly, as are methods for manufacturing such a backlight assembly. In one embodiment, the method includes the steps of fabricating a printed wiring board (PWB) having a display-facing surface, disposing a casing sidewall around the PWB to create light cavity within the backlight assembly, and electrically coupling a plurality of light emitting diodes (LEDs) to the PWB. A reflective solder mask is deposited over the display-facing surface of the PWB, and a first reflective silkscreen layer is applied over the reflective solder mask utilizing a silkscreen process. The first reflective silkscreen layer cooperates with the reflective solder mask to increase the reflectivity of the light cavity over the visible color spectrum. |
