发明名称 HEAT-CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR
摘要 <p>A heat-conductive film (10) comprises: a substrate (12) composed of resin; and a scaly filler (14) dispersed in the substrate (12). The scaly filler (14) contains a scaly filler body (16) composed of boron nitride and a coat of -ferrite (18) coating the filler body (16), and orients in the thickness direction of the heat-conductive film (10). The resin is, for example, polyimide.</p>
申请公布号 WO2012101988(A1) 申请公布日期 2012.08.02
申请号 WO2012JP00285 申请日期 2012.01.18
申请人 NITTO DENKO CORPORATION;TAKAYAMA, YOSHINARI;TAGAWA, KENICHI;KITAGAWA, DAISUKE;TAKAHASHI, TATSUHIRO;YONETAKE, KOICHIRO;AWANO, HIROSHI;SHOJI, TAKUMI;TADA, MITSUTERU 发明人 TAKAYAMA, YOSHINARI;TAGAWA, KENICHI;KITAGAWA, DAISUKE;TAKAHASHI, TATSUHIRO;YONETAKE, KOICHIRO;AWANO, HIROSHI;SHOJI, TAKUMI;TADA, MITSUTERU
分类号 C08J5/18;C08J3/20;C08K3/38;C08L79/08;C08L101/00 主分类号 C08J5/18
代理机构 代理人
主权项
地址