| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve mounting of an electronic circuit component on a plurality of sheets of circuit base materials by a mounting head which holds a plurality of sucking nozzles. <P>SOLUTION: A substrate conveyer device composed of a conveyer of two lanes is caused to carry two circuit boards separately. After completion of mounting of a component on one of the circuit boards, an electronic circuit component is mounted on the other. In the case where a mounting head containing four sucking nozzles of the same kind mounts five electronic circuit components of the same kind on a single circuit board, all sucking nozzles are caused to hold electronic circuit components at every single sucking/mounting operation. At a first sucking/mounting operation, four electronic circuit components are mounted on a first circuit board. At a second sucking/mounting operation, one of four electronic circuit components is mounted on the first circuit board, and three of them are mounted on a second circuit board. At a third sucking/mounting operation, two of four electronic circuit components are mounted on the second circuit board. Only three sucking/mounting operations are required for mounting components on the two circuit boards, requiring less frequency than a conventional operation in which mounting of components is performed in unit of circuit board and four sucking/mounting operations are performed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
