发明名称 CIRCUIT BOARD WITH HARDENING AGENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit board with a hardening agent and a connection structure which are excellent in low-temperature connectability and connection reliability in electrical connection between circuit boards having circuit electrodes. <P>SOLUTION: The circuit board with the hardening agent is formed by forming a film-forming resin, a hardening agent layer containing a hardening agent and a tackifying resin not hardened by the hardening agent, and a protective film layer made of a protective film in this order on the circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012146881(A) 申请公布日期 2012.08.02
申请号 JP20110005225 申请日期 2011.01.13
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 OTANI AKIRA;NAKAMOTO TETSUO
分类号 H05K1/02;C09J7/02;C09J9/02;C09J11/06;C09J11/08;C09J201/00;H01L21/60;H05K1/03;H05K3/38 主分类号 H05K1/02
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