发明名称 |
CIRCUIT BOARD WITH HARDENING AGENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board with a hardening agent and a connection structure which are excellent in low-temperature connectability and connection reliability in electrical connection between circuit boards having circuit electrodes. <P>SOLUTION: The circuit board with the hardening agent is formed by forming a film-forming resin, a hardening agent layer containing a hardening agent and a tackifying resin not hardened by the hardening agent, and a protective film layer made of a protective film in this order on the circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012146881(A) |
申请公布日期 |
2012.08.02 |
申请号 |
JP20110005225 |
申请日期 |
2011.01.13 |
申请人 |
ASAHI KASEI E-MATERIALS CORP |
发明人 |
OTANI AKIRA;NAKAMOTO TETSUO |
分类号 |
H05K1/02;C09J7/02;C09J9/02;C09J11/06;C09J11/08;C09J201/00;H01L21/60;H05K1/03;H05K3/38 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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