| 摘要 |
The purpose of the present invention is to reduce thermal stress and thermal strain during manufacturing and to provide a low thermal resistance, low-cost circuit substrate and a semiconductor device using the same. The present invention is characterized by being circuit substrate provided with a ceramic substrate containing a nitride, a circuit wiring board joined to one surface of the ceramic substrate via a joining layer, and a metal support member joined to the other side of the ceramic substrate via a joining layer, and the joining layers being sintered compacts that contain silver or copper. The present invention is further characterized by the circuit substrate having oxide layers at the junction interface of the ceramic substrate and sintered compacts, and the oxide layers being constituted of a polycrystalline layer on the ceramic substrate side and being constituted of a noncrystalline layer on the sintered compact side. |
