发明名称 SUBSTRATE SUPPORT WITH HEATER AND RAPID TEMPERATURE CHANGE
摘要 Embodiments of substrate supports with a heater and an integrated chiller are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member, a heater disposed beneath the first member and having one or more heating zones to provide heat to the first member, a plurality of cooling channels disposed beneath the first member to remove heat provided by the heater, a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support, and an alignment guide extending from the first surface of the first member and about the plurality of substrate support pins.
申请公布号 WO2012103294(A2) 申请公布日期 2012.08.02
申请号 WO2012US22661 申请日期 2012.01.26
申请人 APPLIED MATERIALS, INC.;VOLFOVSKI, LEON;KULKARNI, MAYUR G.;MINKOVICH, ALEX 发明人 VOLFOVSKI, LEON;KULKARNI, MAYUR G.;MINKOVICH, ALEX
分类号 H01L21/683;G02F1/13;H01L21/68;H05B3/20 主分类号 H01L21/683
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