发明名称 |
SUBSTRATE SUPPORT WITH HEATER AND RAPID TEMPERATURE CHANGE |
摘要 |
Embodiments of substrate supports with a heater and an integrated chiller are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member, a heater disposed beneath the first member and having one or more heating zones to provide heat to the first member, a plurality of cooling channels disposed beneath the first member to remove heat provided by the heater, a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support, and an alignment guide extending from the first surface of the first member and about the plurality of substrate support pins. |
申请公布号 |
WO2012103294(A2) |
申请公布日期 |
2012.08.02 |
申请号 |
WO2012US22661 |
申请日期 |
2012.01.26 |
申请人 |
APPLIED MATERIALS, INC.;VOLFOVSKI, LEON;KULKARNI, MAYUR G.;MINKOVICH, ALEX |
发明人 |
VOLFOVSKI, LEON;KULKARNI, MAYUR G.;MINKOVICH, ALEX |
分类号 |
H01L21/683;G02F1/13;H01L21/68;H05B3/20 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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