发明名称 |
REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING |
摘要 |
Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier. |
申请公布号 |
US2012193014(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
US201113015638 |
申请日期 |
2011.01.28 |
申请人 |
KNICKERBOCKER SARAH H.;GRIFFITH JONATHAN H.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KNICKERBOCKER SARAH H.;GRIFFITH JONATHAN H. |
分类号 |
B32B37/12;B32B37/02;B32B37/06;B32B37/08;B32B37/10;B32B37/14;B32B38/00;B32B38/10 |
主分类号 |
B32B37/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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