发明名称 SEMICONDUCTOR DEVICE
摘要 <p>The purpose of the present invention is to provide a semiconductor device that can suppress device size shrinkage, reduction in series resistance, and leak current. The present invention ventures to insert into the device structure a layer that generates a difference in electric potential that was unnecessary conventionally for device operation. Even when a semiconductor with a small band gap is exposed on a mesa side surface, this difference in electric potential provides a function that can suppress the amount of drop in electric potential in that part and reduce leak current that is inconvenient for device operation. As a result, obtaining these effects is common to heterostructure bipolar transistors, photodiodes, electroabsorption optical modulators, and other devices. Furthermore, in photodiodes, leak current is relaxed; therefore the device size can be reduced. Not only is operating speed improved by reducing series resistance, but also the advantage of being able to dispose devices in a high density array form arises.</p>
申请公布号 WO2012102196(A1) 申请公布日期 2012.08.02
申请号 WO2012JP51178 申请日期 2012.01.20
申请人 NTT ELECTRONICS CORPORATION;NIPPON TELEGRAPH AND TELEPHONE CORPORATION;ISHIBASHI, TADAO;ANDO, SEIGO;MURAMOTO, YOSHIFUMI;YOSHIMATSU, TOSHIHIDE;YOKOYAMA, HARUKI 发明人 ISHIBASHI, TADAO;ANDO, SEIGO;MURAMOTO, YOSHIFUMI;YOSHIMATSU, TOSHIHIDE;YOKOYAMA, HARUKI
分类号 H01L21/331;G02F1/017;H01L29/737;H01L31/10 主分类号 H01L21/331
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