发明名称 PICKING MODULE FOR PICK AND PLACE APPARATUS OF TEST HANDLER
摘要 PURPOSE: A picking module for a pick and place device of a test handler is provided to control the gripping degradation of a picker by preventing excessive deformation of an adsorption pad of the picker. CONSTITUTION: A picking module(200) comprises 9 pickers(210) and a main body(220). The picker comprises a coupling member(211), an adsorption pad(212), a spring(213), and a deformation preventing member(214). The coupling member is combined with the main body which can be ascended and descended. The adsorption pad is combined with the coupling member. The adsorption pad adsorbs or grips a semiconductor device through vacuum pressure. An elastic member adds elastic force to the coupling member downwards. The deformation preventing member is ascended and descended by being connected to the elevation of the coupling member. The deformation preventing member prevents excessive deformation of the adsorption pad according to abnormal contact between the semiconductor device and the adsorption pad. The main body and the coupling member have a feeding passageway for transferring the vacuum pressure to the adsorption pad.
申请公布号 KR20120085948(A) 申请公布日期 2012.08.02
申请号 KR20110007087 申请日期 2011.01.25
申请人 TECHWING CO., LTD. 发明人 NA, YUN SUNG;KWEON, YOUNG HO
分类号 G01R31/26;B25J15/06;H01L21/66;H01L21/67 主分类号 G01R31/26
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