发明名称 METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE, AND JOINTING DEVICE OF SOLDER FOIL
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for a power module and a jointing device of a solder foil, capable of providing a strong bondability between a ceramic substrate and a conductor pattern layer, for improved assembly workability. <P>SOLUTION: The manufacturing method includes a pattern formation step in which a conductor pattern layer 6 and a solder foil 9 are temporarily fixed in laminated condition and a conductor pattern member 10 is punched out, a lamination step in which the conductor pattern member 10 and a ceramic substrate 2 are so stacked as to interpose the solder foil 9, and a jointing step for brazing the laminate. In the pattern formation step, while a band-like base material 60 is caused to travel under such condition as a band-like solder foil 90 having the width equal to or narrower than the base material 60 is being stacked, the solder foil 90 is intermittently welded to the surface of the base material 60, with an interval along the travelling direction. Thus, a welding part 12 is formed along two sides facing each other of an outline 11 of the conductor pattern layer 6. By punching out the base material 60 and the solder coil 90 at the same time, the conductor pattern member 10 is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012146930(A) 申请公布日期 2012.08.02
申请号 JP20110006129 申请日期 2011.01.14
申请人 MITSUBISHI MATERIALS CORP 发明人 OI SOTARO;AOKI SHINSUKE
分类号 H01L23/12;H05K3/32 主分类号 H01L23/12
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