发明名称 FORMING METHOD OF AMORPHOUS SILICON FILM AND FILM FORMING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a forming method of an amorphous silicon film capable of further improving precision of surface roughness and coping with progress of miniaturization of contact holes and lines or the like. <P>SOLUTION: A forming method of an amorphous silicon film comprises a step of forming a seed layer 3 on a surface of a base 2 by heating the base 2 and flowing aminosilane-based gas to the heated base 2 and a step of forming an amorphous silicon film on the seed layer 3 by heating the base 2, supplying silane-based gas containing no amino group to the seed layer 3 on a surface of the heated base 2, and thermally decomposing the silane-based gas containing no amino group. In the forming method, aminosilane of the aminosilane-based gas is adsorbed on the base without being thermally decomposed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012147016(A) 申请公布日期 2012.08.02
申请号 JP20120084169 申请日期 2012.04.02
申请人 TOKYO ELECTRON LTD 发明人 HASEBE KAZUHIDE;MURAKAMI HIROKI;KAKIMOTO AKINAGA
分类号 H01L21/205;C23C16/24;H01L21/28;H01L21/285 主分类号 H01L21/205
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