DEVICE PACKAGE AND METHODS FOR FABRICATION AND TEST THEREOF

摘要

PROBLEM TO BE SOLVED: To provide hermetically sealed optoelectronic device packages.

SOLUTION: The packages comprises a base substrate having a mounting region 10 of an optoelectronic device 12 on a surface of the base substrate and a mounting region of a lid 200. An enclosed volume is formed between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, in which at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path.

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