| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method capable of providing a position correction effect by using a proper surface correction data at always, even in the case where a temperature fluctuation occurs because of temporary change in device operation state. <P>SOLUTION: A surface correction data is generated by recognizing a position reference point and each of a plurality of measurement points of a surface correction substrate using a camera. Here, a shaft temperature of a drive shaft which is measured for each drive shaft of a head moving mechanism that moves the camera and a mounting head, and individual displacement data representing a displacement amount from a measurement reference time point at a plurality of measurement points and a position reference point acquired by recognition at the time point, are related each other, and stored as a displacement/temperature correlation data. During the process in which the mounting head is positioned relative to the substrate at the time of a component mounting operation, a position correction amount of the mounting head is calculated based on the displacement amount acquired by recognizing the position reference point and the displacement/temperature correlation data. <P>COPYRIGHT: (C)2012,JPO&INPIT |
