| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vibration isolation interposer die to damp out vibration and/or large shocks from an inertial measurement unit (IMU). <P>SOLUTION: In an example, an interposer chip is provided. The interposer chip includes a base portion 204 and a chip mounting portion 202. The interposer chip also includes one or more flexures 302 connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections 402-1, 402-2 extends from the base portion towards the chip mounting portion, and a second plurality of projections 404-1, 404-2 extends from the chip mounting portion towards the base portion and extending into interstices formed by the first plurality of projections. <P>COPYRIGHT: (C)2012,JPO&INPIT |
