| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the overall shape of a sealing resin molding device for electronic components from being enlarged, and to improve quality and productivity of a seal resin molding (resin molded substrate 14) for the electronic components. <P>SOLUTION: At least two sets of resin molds 6 and 7 are vertically and horizontally disposed in series, and tip pressurizing part 17a of a resin pressurizing plunger 17 is fitted into each of resin material supply pots 6f and 7f in the resin molds 6 and 7 in a slidable state from the same direction, and the overall shape of a resin molding device is prevented from being enlarged in the direction of the resin molds 6 and 7 disposed in series. A die opening and closing mechanism of each of the resin molds 6 and 7 can be used for both resin molds by disposing the resin molds 6 and 7 in series, and accordingly, equalization of resin molding conditions such as mold clamping pressure in the resin molds 6 and 7 and resin pressurizing force applied to a resin material can be achieved, and a seal resin molding 14 having equal and high quality for electronic components can be highly efficiently produced. <P>COPYRIGHT: (C)2012,JPO&INPIT |
