发明名称 LED LIGHTING COLUMN WITH FAST HEAT DISSIPATION
摘要 The present invention discloses an LED lighting column with fast heat dissipation. The device includes two PCB substrates. LED chips are packaged on the front surfaces of the two PCB substrates. The LED chips connect with the PCB substrates electrically. The back surfaces of the two PCB substrates are tightly attached to each other, and a heat-dissipating metal plate is clamped between the back surfaces of the two PCB substrates. Since LED chips are provided on both sides of the LED lighting column, during irradiance of the LED chips, radial irradiance can be realized and the scope of the light beams is large. Furthermore, the heat-dissipating metal plate of the present invention can quickly conduct the heat which has been accumulated on the PCB substrates. Therefore, the present invention has the characteristics that the scope of the light beams is large and heat dissipation is quick.
申请公布号 WO2012100461(A1) 申请公布日期 2012.08.02
申请号 WO2011CN72523 申请日期 2011.04.08
申请人 DONGGUAN CITY MEINENG ELECTRONIC LIMITED;WU, ZHIHUA;XIE, YIMING;LIN, YUEHUI;SHAO, XIAOBING 发明人 WU, ZHIHUA;XIE, YIMING;LIN, YUEHUI;SHAO, XIAOBING
分类号 F21V29/00;F21Y101/02 主分类号 F21V29/00
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