发明名称 |
GLASS-EMBEDDED SILICON SUBSTRATE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>A method for manufacturing a glass-embedded silicon substrate, the method comprising: a step for forming a recess (11) in a silicon substrate (10); a step for filling the recess (11) with a glass material (20a) in the form of a powder, a paste, or a precursor solution; a step for heating and softening the glass material (20a); a step for sintering the softened glass material (20a); and a step for exposing the glass material (20a) and the silicon substrate (10) on the front and back surfaces of the silicon substrate (10) where the recess (11) is filled with the glass material (20a).</p> |
申请公布号 |
WO2012102291(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
WO2012JP51505 |
申请日期 |
2012.01.25 |
申请人 |
PANASONIC CORPORATION;OKUMURA, SHIN;TAURA, TAKUMI;NAKATANI, TOMOHIRO;TOMOIDA, RYO |
发明人 |
OKUMURA, SHIN;TAURA, TAKUMI;NAKATANI, TOMOHIRO;TOMOIDA, RYO |
分类号 |
H01L23/02;C03C27/04;G01P15/08;G01P15/125;H01L23/06;H01L23/08;H01L23/14;H01L29/84 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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