| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a rear surface of an element mounted part, where a smaller amount of a sealing resin seeps into, is exposed. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip 100; a lead frame 200; and a sealing resin 500. The lead frame 200 has an element mounted part 220 on which the semiconductor chip 100 is mounted. Further, the sealing resin 500 seals a mounted surface (not shown in the figure) of the semiconductor chip 100 in the element mounted part 220 and leads 260 of the lead frame 200. The element mounted part 220 comprises: an inclined part 240, inclining toward the back surface side of the element mounted part 220, on the mounted surface of the semiconductor chip 100 in a peripheral part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
