| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flexible metal foil-clad laminate in which swelling is not generated in solder processing even in a state of positively absorbed moisture. <P>SOLUTION: A multilayer polyimide film has a thermoplastic polyimide layer which includes the thermoplastic polyimide at least on one side of a non-thermal, plastic polyimide layer, including a non-thermal, plastic polyimide. In the multilayer polyimide film, the dianhydride that composes the thermoplastic polyimide makes the 3,3',4,4'-biphenyl tetracarboxylic dianhydride and the pyromellitic dianhydride essential components and those molar ratios are 5/95-30/70; the diamine makes 2,2-bis [4-(4-aminophenoxy) phenyl] propane an essential component; the dianhydride that composes the non-thermal, plastic polyimide makes the pyromellitic dianhydride an essential component, and the diamine makes 2,2-bis[4-(4-aminophenoxy) phenyl]propane an essential component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
