| 摘要 |
An integrated circuit (IC) die includes a substrate including a topside surface having active circuitry and a bottomside surface. A plurality of protruding bonding features are on the topside surface or bottomside surface and include at least one metal. The protruding bonding features including sidewalls having a neck region that includes an interface at or proximate to the topside surface or the bottomside surface. The protruding bonding features extend outward to a distal top edge. A dielectric support is positioned on the topside surface or bottomside surface between protruding bonding features. The dielectric support contacts and surrounds the sidewalls of the neck regions, does not extend beyond a height of the distal top edge, and is at least twenty percent taller where contacting the sidewalls as compared to a minimum non-zero height in a location between adjacent bonding features.
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