发明名称 |
VIA WITH A SUBSTANTIALLY PLANAR TOP SURFACE |
摘要 |
A via (314), which touches a non-conductive structure (114) and an underlying conductive structure (110), has a top surface where the entire top surface of the via (314) is substantially planar. The substantially planar entire top surface of the via (314) improves structures that are effected by the planarity of the top surface of the via (314). |
申请公布号 |
WO2012005836(A3) |
申请公布日期 |
2012.08.02 |
申请号 |
WO2011US38563 |
申请日期 |
2011.05.31 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
AKLIK, MEHMET, EMIN;MOUTINHO, THOMAS, JAMES |
分类号 |
H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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