METHOD FOR APPLYING FILM, METHOD FOR GRINDING BACK SURFACE, METHOD FOR FORMING SEMICONDUCTOR CHIP, AND APPARATUS FOR APPLYING FILM

摘要

In the technology for applying a film to a surface of an object for grinding a back surface etc., to apply a film accurately by using a simple technique. An object (10) having a first surface (10a) and a second surface (10b) opposite to the first surface, a flexible film (12) having a front surface (12a) larger than the first surface of the object, a frame member (14) shaped and sized so as to be placeable along a perimeter of the film and having a rigidity higher than a rigidity of the film, and a liquid adhesive (16), are provided. The liquid adhesive is arranged on the first surface of the object or the front surface of the film. The frame member is fixed to the film along the perimeter of the film. The object and the film are arranged in a relative position where the first surface is opposed to the front surface, and a region of the film along the perimeter of the film extends outward from the object, and the first surface and the front surface are both brought into contact with the liquid adhesive. The liquid adhesive is solidified to securely attach the film to the first surface of the object.