WAFER-LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

Disclosed are a wafer-level light emitting diode package and a method for manufacturing thereof. The method comprises the following steps: forming a plurality of semiconductor laminated structures on a first substrate; preparing second substrate first lead electrodes and second lead electrodes which are arranged to correspond to a plurality of semiconductor laminated structures; coupling a plurality of semiconductor laminated structures to the second substrate; and partitioning the first and the second substrates to a plurality of packages after coupling the substrates. Therefore, the wafer-level light emitting diode package is provided.