<p>A method for forming a semiconductor structure comprises steps: forming a dummy gate (206) on a semiconductor substrate (202); forming source/drain areas (208) and a channel area (214) circling around the side wall (212) of the dummy gate (206); removing the dummy gate (206) to form a gate gap (222); forming a stress material layer (226) inside of the gate gap (222); annealing the semiconductor substrate (202); removing the stress material layer (226) inside of the gate gap (222); and forming a gate electrode (230) in the gate gap (222).</p>
申请公布号
WO2012100463(A1)
申请公布日期
2012.08.02
申请号
WO2011CN72961
申请日期
2011.04.18
申请人
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES;ZHU, HUILONG;YIN, HAIZHOU;LUO, ZHIJIONG