| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package which prevents conductor base plate's warpage from occurring during silver soldering due to a difference in thermal expansion coefficients of the conductor base plate and a metal outer wall. <P>SOLUTION: A package includes: a conductor base plate; a semiconductor device disposed on the conductor base plate; a metal wall which includes the semiconductor device therein, is disposed on the conductor base plate, and has multiple openings at a surface contacting with the conductor base plate; and blocks filling the openings. <P>COPYRIGHT: (C)2012,JPO&INPIT |
