| 摘要 |
<P>PROBLEM TO BE SOLVED: To relax stress applied to a semiconductor substrate included in a semiconductor integrated circuit chip when the semiconductor integrated circuit chip is bonded to a packaging board with an encapsulation resin, thereby reducing variation in semiconductor element characteristics caused by stress and achieving efficient heat radiation during a circuit operation. <P>SOLUTION: A semiconductor device includes a semiconductor circuit formation layer 2 formed on a surface of a semiconductor substrate 1, transistors formed in the semiconductor circuit formation layer 2 and included in a semiconductor circuit, and electrodes 5 formed on the semiconductor circuit formation layer 2 and electrically connected with the semiconductor circuit. Further, the semiconductor device comprises a recess 7 formed on a rear face side of the semiconductor substrate 1 and a metal film 6 formed on the rear face including the recess 7. For example, the electrodes 5 and pad electrodes 9 of a wiring board body 8 are thermal compression bonded and the semiconductor device is bonded to a wiring board with an encapsulation resin 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
