发明名称 SELECTIVE SOLDERING DEVICE AND SELECTIVE SOLDERING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To ensure high quality soldering by heating only a part to be soldered, an area to be soldered or a neighboring area thereof immediately before contact and supply of a molten solder, thereby relaxing heat stress at the part to be soldered and enhancing solder wettability at the part to be soldered, while furthermore by performing pre-activation of flux. <P>SOLUTION: A heater heating a predetermined area and having a contour smaller than the shape of the plate surface of a work to be soldered is provided near the nozzle tip position. At first, the relative position of a molten solder on the nozzle and the work to be soldered is adjusted by relative position adjusting means so that the molten solder and the work do not come into contact, and then the predetermined area is heated by the heater. Subsequently, the molten solder on the nozzle and the predetermined area of the planar work to be soldered are brought into contact thus soldering only the part to be soldered in a selected area. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012146842(A) 申请公布日期 2012.08.02
申请号 JP20110004617 申请日期 2011.01.13
申请人 SENSBEY CO LTD 发明人 KIMURA MASAHIRO;MORIYA SHOICHI
分类号 H05K3/34;B23K1/08;B23K3/00;B23K31/02;B23K101/42 主分类号 H05K3/34
代理机构 代理人
主权项
地址