发明名称 SEMICONDUCTOR TESTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor testing device capable of reducing an external load while ensuring excellent contact state between an external terminal and a conductive contact. <P>SOLUTION: A semiconductor testing device comprises: a plurality of conductive contacts 10 which are extensible and contractible in the direction of an external terminal 3 of a semiconductor device 2 and which can elastically contact with the external terminal 3; a nonconductive holding member 21 which holds the conductive contacts 10; and a guide plate 22 held by the holding member 21, which has a first through hole 22b allowing conductive contacts required for testing out of the conductive contacts to pass through and a second through hole 22a having a bore diameter smaller than that of the first through hole 22b and not allowing conductive contacts, which are not required for testing out of the conductive contacts, to pass through. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012145454(A) 申请公布日期 2012.08.02
申请号 JP20110004243 申请日期 2011.01.12
申请人 RENESAS ELECTRONICS CORP 发明人 UEKI TAKANORI
分类号 G01R31/26;G01R1/067;H01R33/76 主分类号 G01R31/26
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