| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface inspection method that improves measurement precision of a line width of a repeated pattern. <P>SOLUTION: A surface inspection method includes: an irradiation step (S102) for irradiating a wafer surface having a prescribed repeated pattern with linearly polarized light; a light receiving step (S103) for receiving reflected light from the wafer surface irradiated with the linearly polarized light; a detection step (S104) for detecting a polarization component perpendicular to a polarization direction of the linearly polarized light in the reflected light, on a conjugate surface to a pupil surface of an objective lense; and a calculation step (S105) for obtaining a line width of the repeated pattern from a gradation value of the detected polarization component. In the calculation step, the line width of the repeated pattern is obtained from the gradation value at a position in a pupil on a diagonal line and at a position in a pupil off the diagonal line on the pupil surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
