发明名称 Silicon-Based Cooling Package for Light-Emitting Devices
摘要 Various embodiments of a thermal energy transfer apparatus that removes thermal energy from a light-emitting device are described. In one aspect, an apparatus comprises a silicon-based base plate and a silicon-based cover element disposed on the base plate. The base plate includes a recess to receive a light-emitting device therein. The base plate is coated with a first electrically-conductive pattern that forms a first electrode. The base plate is further coated with a second electrically-conductive pattern that is electrically isolated from the first electrically-conductive pattern. The cover element holds the light-emitting device between the base plate and the cover element with at least a portion of a light-emitting surface of the light-emitting device exposed. The cover element is coated with a third electrically-conductive pattern that is in contact with the second electrically-conductive pattern to form a second electrode when the cover element is disposed on the base plate.
申请公布号 US2012195051(A1) 申请公布日期 2012.08.02
申请号 US201213359592 申请日期 2012.01.27
申请人 KIM GERALD HO 发明人 KIM GERALD HO
分类号 F21V5/04;F21V15/01 主分类号 F21V5/04
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