PACKAGE WITH HEAT SCORE

摘要

The present invention addresses certain problems facing flexible packages and the packaging industry. Embodiments of the present invention are directed to a method of heat scoring the film or material of the package in various shapes and locations to facilitate the consumer opening the package. Embodiments are also directed to a heat scoring device for delivering the heat score to the package material during the manufacturing process. Other embodiments are directed to a package having one or more heat scores for permitting a user to easily access the contents of a package while maintaining the integrity of the package.