发明名称 |
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE |
摘要 |
A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips. |
申请公布号 |
US2012196408(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
US201213433468 |
申请日期 |
2012.03.29 |
申请人 |
KADAKIA SURESH D.;SIKKA KAMAL K.;TOY HILTON T.;ZITZ JEFFREY A.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KADAKIA SURESH D.;SIKKA KAMAL K.;TOY HILTON T.;ZITZ JEFFREY A. |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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