发明名称 TEST HEAD AND SEMICONDUCTOR WAFER TESTING APPARATUS PROVIDED WITH THE SAME
摘要 [Object] Providing a test head capable of suppressing a probe card from bending. [Means for Solving] The test head 40 comprises: a test head main body 51 having a frame 51; an interface apparatus 60 electrically connecting a probe card 20 and the test head main body 50 with each other; and a brake unit 80 positioned between the probe card 20 and the frame 51 to transmit a pressing force F applied to the probe card 20 to the frame 51.
申请公布号 KR101168903(B1) 申请公布日期 2012.08.02
申请号 KR20110007673 申请日期 2011.01.26
申请人 发明人
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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