| 摘要 |
PURPOSE: An etchant composition is provided to form excellent pattern shape by etch-processing with high accuracy a metal laminate film pattern comprising a copper and copper alloy thin film. CONSTITUTION: An etchant composition is formed by etching a metal laminate layer comprising a layer consisting of a copper layer, cooper alloy(but, alloy consisting of copper, molybdenum and/or titanium is excluded), and mixing 40-60 weight% of phosphoric acid, 1.5-4.0 weight% of phosphoric acid, 25-45 weight% of acetic acid, and water. The metal laminate layer consists of a constitution of copper/copper alloy, or copper alloy/copper/copper alloy. The cooper alloy contacts to a substrate. The copper alloy is copper-magnesium-aluminum, or copper-magnesium-aluminum oxide.
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