发明名称 |
Through-Hole-Vias In Multi-Layer Printed Circuit Boards |
摘要 |
Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.
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申请公布号 |
US2012193135(A1) |
申请公布日期 |
2012.08.02 |
申请号 |
US201213446727 |
申请日期 |
2012.04.13 |
申请人 |
CASES MOISES;KIM TAE HONG;MANDREKAR ROHAN U.;SHERALI NUSRAT I.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CASES MOISES;KIM TAE HONG;MANDREKAR ROHAN U.;SHERALI NUSRAT I. |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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