The purpose is to provide a method for producing semiconductor devices that makes it possible to efficiently laser-mark a film for the rear surface of a flip chip semiconductor. A method for producing semiconductor devices is provided with: a step (A) for preparing an adhesive layer-containing semiconductor rear surface film having a flip chip semiconductor rear surface film and a ring-shaped adhesive layer provided around the periphery of the flip chip semiconductor rear surface film; a step (B) for pasting a semiconductor wafer onto the flip chip semiconductor rear surface film in an area not having the adhesive layer layered thereon and more to the inside than the adhesive layer; a step (C) for pasting a dicing ring on the adhesive layer; and a step (D) for laser-marking the flip chip semiconductor rear surface film after completion of the step (B) and the step (C).
