发明名称 Compliant Off-Chip Interconnects for Use in Electronic Packages and Fabrication Methods
摘要 Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.
申请公布号 US2012192418(A1) 申请公布日期 2012.08.02
申请号 US201213435977 申请日期 2012.03.30
申请人 KACKER KARAN;SITARAMAN SURESH K.;GEORGIA TECH RESEARCH CORPORATION 发明人 KACKER KARAN;SITARAMAN SURESH K.
分类号 H01R12/57;H01R43/16 主分类号 H01R12/57
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