| 发明名称 |
Compression Clamping of Semiconductor Components |
| 摘要 |
The present invention relates to a method of clamping a semiconductor assembly with a desired compression force equally distributed across the opposing surfaces of the devices and associated components of the semiconductor assembly. |
| 申请公布号 |
US2012192392(A1) |
申请公布日期 |
2012.08.02 |
| 申请号 |
US201213416429 |
申请日期 |
2012.03.09 |
| 申请人 |
FISHMAN OLEG S.;PRABHU SATYEN N.;INDUCTOTHERM CORP. |
发明人 |
FISHMAN OLEG S.;PRABHU SATYEN N. |
| 分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
| 代理机构 |
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