| 摘要 |
<p>A first resin material (41b) is filled between one recess (42c) among a plurality of recesses (42c) formed on a sub-master substrate (42) and a first molding face (31) of a master die (30), and thus, while ensuring the thickness of the first resin material (41b) opposing to the first molding face (31), the thickness of a sub-sub-master resin layer (51) formed on the entirety of the sub-master substrate (42) can be made relatively thin. Thereby, while easily increasing the positioning accuracy of the master die (30), the warpage of the sub-master substrate (42) by the sub-sub-master resin layer (51) can be prevented. By providing an annular step (32) around the first molding face (31), a residual film portion (44) defined by the outer edge portion of the sub-sub-master resin layer (51) can be formed between the step (32) and a portion around the recess (42c). Due to the residual film portion (44), the sub-sub-master resin layer (51) can be prevented from being locally thick, and as a result, the thickness of the obtained wafer lens (10) can be thin.</p> |
