| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a single wafer cleaning device having high cleaning quality. <P>SOLUTION: The single wafer cleaning device comprises: a turntable 12 which supports a wafer 1 in a chamber 11; a cleaning liquid supply nozzle 13 which supplies cleaning liquid to the surface of the wafer 1; a spin cup 14 provided on the periphery of the turntable 12; an air outlet 15 provided on the periphery of the turntable 12; a spin cup lifting mechanism 16 which performs elevation control of the spin cup 14; an air outlet 17 provided in the side surface of a chamber 11; and a shutter 18 which opens and closes the air outlet 17. The shutter 18 is interlocked with the spin cup 14 to lift or lower, closes the air outlet 17 when the spin cup 14 lifts to open the air outlet 15, and opens the air outlet 17 when the spin cup 14 lowers to close the air outlet 15. Consequently, the internal pressure of the chamber 11 can be held at a substantially constant level. <P>COPYRIGHT: (C)2012,JPO&INPIT |
