| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which eliminates deposits adhered to a low temperature component in a gap between two components having a large temperature difference without lowering the operation rate of the substrate processing apparatus. <P>SOLUTION: In a substrate processing apparatus 10, a chamber 11 houses a wafer W, and a focus ring 25 encloses a periphery of the wafer W placed in the chamber 11. A side surface protection member 26 transmits laser light, and a laser light radiation device radiates the laser light to the side surface protection member 26. In the focus ring 25, an inner focus ring 25a is located adjacent to the wafer W and is cooled, and an outer focus ring 25b encloses the inner focus ring 25a and is not cooled. A facing surface of the side surface protection member 26 faces a gap between the inner focus ring 25a and the outer focus ring 25b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
