| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a primer composition, wherein adhesiveness between a substrate having a photosemiconductor element mounted thereon and a cured product of an addition reaction curing type silicone composition for sealing the photosemiconductor element is improved, and a metal electrode formed on the substrate can be prevented from being corroded; and to provide a high-reliable optical semiconductor device using the same. <P>SOLUTION: The primer composition for making the substrate having the photosemiconductor element mounted thereon adhere to the cured product of the addition reaction curing type silicone composition for sealing the photosemiconductor element comprises: (A) a silazane compound or a polysilazane compound which has at least one silazane bond in one molecule; and (B) a solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
