| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board which allows enhancement of positioning accuracy even of an electronic component where the pitch of leads is relatively small, and allows enhancement of the mounting strength by enhancing the solder wicking when mounting a component by a lead-free solder. <P>SOLUTION: Near both ends of an array of a plurality of component mounting through holes 2 in a printed circuit board 1, four heat receiving through holes 3 are provided per one end. The plurality of component mounting through holes 2 include a pair of end side through holes 2A, 2E, and center side through holes 2B-2D. The end side through holes 2A, 2E are arranged, respectively, at both ends of the array of a plurality of component mounting through holes 2. The center side through holes 2B-2D are arranged at positions other than the both ends of the array of a plurality of component mounting through holes 2. The center side through holes 2B-2D are elongated holes where a direction orthogonal to the array direction is the long axis direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
