发明名称 MOTION ANALYSIS DEVICE AND MOTION ANALYSIS METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a motion analysis device and a motion analysis method capable of analyzing a deformation amount of a measurement object in motion with high accuracy. <P>SOLUTION: The motion analysis device 1 includes two posture angle sensors 10a and 10b attached to the measurement object at locations distant from each other, a data acquisition section 201, a posture angle correction section 202, and a deformation amount calculation section 203. The data acquisition section 201 acquires data of a first posture angle and a second posture angle respectively detected by the posture angle sensors 10a, 10b. The posture angle correction section 202 corrects a difference between the first posture angle and the second posture angle after starting a motion of the measurement object in accordance with a difference between the first posture angle and the second posture angle before starting the motion of the measurement object. The deformation amount calculation section 203 calculates a deformation amount of the measurement object based on a difference between the first posture angle and the second posture angle corrected by the posture angle correction section 202. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012143342(A) 申请公布日期 2012.08.02
申请号 JP20110003012 申请日期 2011.01.11
申请人 SEIKO EPSON CORP 发明人 TAKASUGI TOSHIYASU;SATO MASATOSHI;NOMURA KAZUO
分类号 A63B69/36 主分类号 A63B69/36
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