| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a treatment method for reducing to a deep portion, a printable and formable copper-based particle deposition layer having good adhesiveness to a substrate, low volume resistivity without a substrate damage; and to provide a method for producing a metal copper film preventing copper precipitation outside a printing/coating part, and also a printing metal copper pattern. <P>SOLUTION: The method for production of the metal copper film includes treating a copper-based particle deposition layer formed on the substrate and including particles comprising copper oxide with a gas mixture of gaseous formic acid and at least one organic solvent selected from gaseous monovalent alcohol, ester and ketone at 120°C or higher. <P>COPYRIGHT: (C)2012,JPO&INPIT |
